Packing Power and Performance: Straits Research Forecasts 9.15% CAGR for SiP Die Market
Straits Research has released a new report on the global System-in-Package (SiP) Die market, forecasting substantial growth in the coming years. The market, valued at USD 9.31 billion in 2023, is projected to reach USD 20.47 billion by 2032, growing at a CAGR of 9.15% during the forecast period (2024-2032). The report highlights the increasing demand for SiP dies driven by the continuous evolution of mobile technology, the growing need for miniaturized electronic devices, and the rising adoption of SiP technology across various industri